Agenda 2025 *

3 Days of Concentrated Connector Know-how

From Single Pair Ethernet, intelligent connectors, materials and coatings to additive manufacturing of connectors: this year's user congress program once again offers a wide range of topics.

On the first day, visitors can learn about the basics of connection technology in basic seminars** taking place in parallel.

On the second and third days, participants will receive in-depth, first-hand know-how in numerous presentations by experts from industry, science and research.

This year we will again be offering simultaneous translation of the German-language lectures into English in the plenary session. The relevant lectures are marked with flags in the program.

Monday, May 26, 2025 - Basic Seminars and EMC day

Registration of participants at the Vogel Convention Center (VCC)

Parallel Basic Seminars in the morning

(VCC seminar rooms)

Seminar 1: Connectors – important characteristics and terms

Dr.-Ing. Helmut Katzier | Engineering office for assembly and connection technology

What you will learn:

  • Important characteristic values for connectors
  • Technical explanation of the key figures
  • Relevance of the parameters in different applications
  • >> learn more

    In the field of electrical connectors, many terms from different specialist disciplines are used, the precise knowledge of which is of great importance in the co-operation between users and manufacturers. Terms such as contact overlap, relaxation, gas-tight connections or contact corrosion are frequently used, but not everyone is always familiar with their exact meaning. Especially when analysing and eliminating faults, it is important that the people involved in the conversation know which aspects are being discussed. The seminar explains the most important technical terms relating to electrical connectors. All relevant areas of mechanics, electrical engineering, materials science and qualification are covered. For each technical term there is a precise definition, a basic technical explanation and an explanation of the meaning of the term in the event of a fault. The aim of the basic seminar is to provide participants with a glossary at the end, which they can use to look up the various terms in the field of electrical connectors quickly and thoroughly.

Seminar 2: Basics of contact physics

Dr. Frank Ostendorf  | TE Connectivity Germany GmbH

What you will learn:

  • Basics of Electrical Connector Contacts
  • Influence of coating and base materials
  • Aging and failure mechanisms of connector contacts
  • >> learn more

    The basic seminar introduces the basics of contact physics and explains important terms and the creation of physical quantities such as contact resistance, contact heating and derating. These phenomena are linked to the contact surfaces and the contact coating. The 'contact behavior' of a connector must be viewed as a system property that results from the interaction of the contact coating, the design of the connector, the electrical load, the requirement profile and the environment. The seminar is divided into the following sections:


    • Contact physics fundamentals of the stationary contact 
    • Measurement and simulation of contact surfaces and contact materials 
    • Contact physics comparison of standard surfaces for connectors 
    • Contact heating and derating 
    • Fretting corrosion 
    • Contact behaviour in relation to intermediate layers 
    • Degradation mechanisms of connector contacts

Seminar 3: Copper materials for connectors

Stephan Gross  | Boway Deutschland GmbH

What you will learn:

  • Standard copper and copper materials
  • Copper High-Performance Materials and Technical Properties & Surfaces
  • >> learn more

    Selecting the right copper and copper alloys is a challenging topic. For many developers/designers of connectors, it is not always easy to choose the right material, both technically and commercially. The seminar covers all the basics relevant to connectors and provides information on these semi-finished products, including excursions into mechanical properties, physical properties and a brief overview of the technically relevant surfaces with a focus on tin. The speaker also provides insights into the selection of the critical parameters, as well as the pitfalls that lurk here.

Seminar 4: Basics of cables and wires

Dr.-Ing. Philipp Baron | LAPP Holding SE
Maximilian Christians | LAPP Holding SE

What you will learn:

  • Comprehensive overview of the structure and selection of cables and wires
  • Future developments
  • >> learn more

    Cables and wires are essential for the transmission of electrical energy, data and signals that enable the operation of machines, devices and communication systems. The lecture explains important terms and the structure of a cable, including conductor, insulation, shielding and outer sheath, and explains technical terms such as "core", "strand" and "sheathed cable". The difference between data and power cables is also covered and the technical requirements explained. The selection of the right cable for different applications, based on temperature resistance, mechanical resilience and electromagnetic compatibility, is also discussed. Finally, current developments and future trends, such as highly flexible cables, environmentally friendly materials and intelligent sensors, as well as the effects of digitalisation and automation on cables and wires are presented. The seminar provides a comprehensive overview of the importance, structure and selection of cables and wires as well as future developments.

Parallel Basic Seminars in the afternoon

(VCC seminar rooms)

Seminar 5: Use of Connectors

Herbert Endres | EndresConsult

What you will learn:

  • Understanding of connector components, materials and properties
  • Weighing up the compromises for the respective application
  • >> learn more

    This calendar for connectors shows the relationships and compromises for the selection and application of connectors and provides the basic knowledge for understanding the properties and electrical data. The basics, material selection in production, physical characteristics, processing techniques and the resulting relationships for function and application are explained. The fourteen chapters cover:


    • What is a connector
    • Connector components
    • Connection techniques
    • Insulator materials
    • Contact materials
    • Contact surfaces
    • Contact resistance
    • Shielding measures
    • Interlocking the connectors
    • Housing and mechanics
    • Power electronics
    • High data rates
    • Further processing in the process
    • Connector selection

    In the chapters, the differences are emphasised in detail and the advantages and disadvantages of the individual materials and manufacturing and application processes are presented, weighed up against each other and assessed. Both the application limits (current load at higher ambient temperatures) and the behaviour at the highest data rates are dealt with. The connector catalogue is not intended to be a shopping guide, but rather a compendium of the diversity of properties, designs and processing options. It shows, independent of the manufacturer, which alternatives are available and what the selection of certain characteristics entails, for better or for worse.

Seminar 6: Surface Coating of Contact Materials

Armin Müller |  IMO Oberflächentechnik GmbH

What you will learn:

  • surface finish and geometric requirements of the base material
  • Advantages and disadvantages of the coating metals used
  • Differences between strip and single plating
  • >> learn more

    The seminar teaches the theoretical principles and laws of electroplating. Influences on deposition and a general process sequence for coating parts round off the theoretical basics. For the quality of the coating, many requirements of the base material, the product design and the choice of material must be fulfilled. These are covered in detail and, in addition to the surface properties and geometric requirements of the base material, the interaction between the base and coating materials is also explained. The functional significance, advantages and disadvantages of the coating metals used in connector and electrical engineering as well as current trends are discussed. The techniques of single-part electroplating, such as barrel, vibrobot and rack processes, are presented with the aid of films and the possibilities of coating are explained to the audience using product examples. The selective plating of individual parts completes the portfolio of bulk material plating. The differences and advantages of coil electroplating compared to single part electroplating then form the transition to coil coating. The special process sequence for coil plating is discussed again here and the various processes, such as dip, brush, strip and spot technology using films and various selective tools, are explained. In addition, the process-related tolerances and specifications of the various techniques are explained, as are the dimensional limits of strip electroplating technology. Process experiences and product examples from practice will support the lecture.

Seminar 7: Selection of Plastics for Connectors

Martin Räthlein | Rosenberger GmbH & Co. KG

What you will learn:

  • Requirements for plastics for connectors
  • material properties of the various plastics
  • Test methods for plastics
  • >> learn more

    In particular, fire properties, thermal, mechanical and electrical properties of engineering plastics are discussed for the selection of materials for connectors, also using examples. The very different requirements resulting from the various markets (automotive, electrical, electronics) are taken into account.

    After the presentation, the audience will be able to select the material that best fulfils the respective requirements from the large number of different types of plastic.

Seminar 8: Ensuring Electromagnetic Compatibility (EMC) in a Wired World

Dr. Heinz Zenkner | Publicly appointed and sworn expert for EMC

What you will learn:

  • sources of high-frequency interference
  • Measures along the transmission path to the interface
  • Establishment of pre-compliance measurements for interference emissions from interfaces
  • >> learn more

    As electronics become more complex and interconnected, electromagnetic compatibility (EMC) management is crucial to avoid electromagnetic interference (EMI) that can affect performance or cause malfunctions. Modern EMC measures include the control of EMC in high-speed circuits and power electronics as well as the optimisation of interfaces. The most important strategies include effective filter design with transient protection, optimised earthing and contacting to minimise impedances and consideration of the EMC behaviour of interface cables. The seminar shows how high-frequency interference arises and how it can be reduced at source. Measures along the transmission path up to the interface are also presented. Filter circuits with inductors, capacitors and overvoltage-limiting components play a central role here. The layout design is presented, taking into account impedance matching and signal propagation. Filter components are briefly explained and parasitic impedances and effects that influence filter functionality are discussed. Further applications are used to demonstrate filter topologies, earthing concepts and the selection of suitable components. The next step presents grounding concepts that have a significant influence on "EMC functionality". Housing shielding attenuation, connector contacting and cable shielding attenuation are discussed and important points are explained. The final section describes the structure of precompliance measurements for the interference emission of interfaces. The EMC concept of the device interfaces can be optimised through early testing so that the legal and performance-related requirements can be met - an essential factor in the development of modern electronic products.

Welcome to the EMC Day

Everything about Electromagnetic Compatibility (EMC) in Connection Technology

Kristin Rinortner

ELEKTRONIKPRAXIS

EMC and connectors: Which EMC rules must be observed when using and manufacturing connectors?

Dr. Helmut Katzier

Engineering office for construction and connection technology

EMC game changer: Innovative cable designs for interference-free industrial plants

  • >> learn more

    In this presentation, you will learn more about the causes and characteristics of common-mode currents, which occur or are coupled in between frequency converters and electric motors in particular. The resulting problems with electromagnetic interference and their effects on industrial applications will also be explained. The use of sinusoidal filters, shielding and meshed earthing networks have provided solutions to minimise the symptoms. However, the selection of the correct cable design and connection technology is often neglected.


    This is where the presentation comes in and shows how current research based on EMC coupling paths avoids a design conflict in cable construction. It will explain how potential pitfalls can be avoided through the correct selection and targeted use of connection technology components.


    • Introduction to the topic of EMC in cables and lines
    • Occurrence of common mode currents and their effects
    • HF and LF coupling mechanisms within electrical lines
    • Design conflict in cable construction, as well as a new stranding concept under the magnifying glass
    • Evaluation of various cable structures with regard to leakage currents in the form of harmonics, conducted emission according to IEC 61800-3, induced voltage in the low-frequency range, as well as influence on the efficiency of the drive train

    What you will learn in this lecture: 

    1. Basic knowledge of EMC in drive technology: You will learn how interference currents can be measured and interpreted.
    2. Coupling mechanisms: You will learn about the electrical and magnetic crosstalk mechanisms within cables and lines.
    3. Importance of cable design: the significance of the different designs and their benefits for the trouble-free operation of industrial systems.

Stefan Hilsenbeck

LAPP Holding SE

Board-to-board connectors for hybrid applications data / signals / power

  • >> learn more

    The market is characterised by a wide range of different PCB connectors for the most diverse applications. There are pure power, data and signal board-to-board connectors, as well as hybrid versions that combine power, data and signals by fitting different contacts in one connector.


    The presentation deals with whether this differentiation is absolutely necessary or whether the different purposes can also be served with the same contacts. In addition, a look will be taken at the EMC-compliant design of such a PCB connection, for example with regard to high-speed data transmission alongside power transmission in the same connector.


    To this end, different pin assignments in a board-to-board connection with a hybrid arrangement with data and power transmission are compared with each other as an example in order to obtain answers to the following questions, among others:



    • What effects does a power transmission have on neighbouring data transmissions?
    • To what extent can an electromagnetic field be contained by ground pins and connector shielding?
    • What effects do unpopulated ("empty poles") and unconnected contacts ("dead metal parts") have in a hybrid configuration? What effects result from varying the number and arrangement? 
    • What recommendations can be derived from this for the PCB layout and arrangement?

Thomas Schulze

PHOENIX CONTACT GmbH & Co. KG

Poster-Slam 

The speakers present their topics in short 5-minute presentations on the podium. The audience then awards the best presentation an award.

  • Ethernet Anywhere, how hybrid connector systems are changing automation

    Manuel Rüter

    TE Connectivity Industrial GmbH


    Description:


    One Cable Automation, cabling sharing or hybrid technology - although these terms refer to fundamentally different technologies, the terms are often used today for one and the same end product: "The combination of power and data transmission in one solution". Various solutions on the market can be used as an example here. This technology is currently undergoing significant development.  Whether fibre optic-based or copper, hybrid systems are increasingly conquering the industrial environment. In the past, specific applications or niches were a field of application for such technologies, but the advantages and the issue of sustainability are bringing about a change in established areas. One key to the breakthrough is the broad acceptance of Ethernet as a basis for communication. Standardised communication facilitates implementation and opens up new applications and markets. Extensive innovations are in the pipeline, particularly in the area of widely established metric circular connectors, which are widely represented on the market. The M12-M40 ranges are particularly noteworthy here.


    These innovations are in line with technological topics such as Single Pair Ethernet as well as further developments to the M12 Y code. The first customer implementations and user organisations are already waiting for the launch of these new technologies. The article covers both the technical aspects of the new connector technology, the current standardisation driven by TE as well as the application benefits and the genesis through customer requirements.

  • Nickel phosphorus: A challenge for X-ray fluorescence measurement technology. Or is it?

    Dr. Konstantinos Panos

    Helmut Fischer GmbH Institut für Elektronik und Messtechnik


    Description:


    Nickel phosphorus (NiP) is known as a hard, non-magnetic and corrosion-resistant diffusion barrier from PCB technology and is increasingly being used in connectors. In contrast to PCBs, however, the demands on the measurement technology for plug contacts are higher. For example, the ability to measure the phosphorus content on the smallest measuring spots is required. The phosphor fluorescence line is difficult to excite with the X-ray fluorescence measuring devices typically used for connectors and is strongly absorbed both in the air and at the detector window. X-ray tubes with a chromium anode lead to significant improvements: Measuring time and measured value scatter can be reduced. However, what is good for phosphorus determination is not necessarily advantageous for other measurement tasks. We therefore want to take a holistic view of the chromium tube and, in addition to NiP, also investigate other typical measurement tasks for connectors in comparison to tungsten tubes.

  • Contact springs as a mechatronic component

    Dr. Benjamin Hertweck

    KERN LIEBERS GmbH & Co. KG


    Description:


    Springs in various forms are increasingly being used in electromechanical applications. The preferred material here is stainless steel, which, however, has relatively poor electrical conductivity. Such electrical contacts are therefore limited in their current carrying capacity. One solution according to the state of the art is to use an additional contact element. The KERN LIEBERS Group is therefore pursuing a development approach based on high-performance copper alloys as stainless steel substitutes in order to be able to use various spring elements as a direct conductive element.

    Helical compression springs, wave springs and annular springs are types of springs that are used in various applications. These different types enable customised contacting solutions depending on the installation space or load spectrum. Helical compression springs are cylindrical springs that primarily work under compressive load. Wave springs are a space-optimised alternative. Ring springs, on the other hand, consist of one or more concentric rings and offer a high load capacity under axial and radial loads. Miniaturisation is also playing an increasingly important role in the development of springs. Particularly in electromechanical applications, miniaturised springs allow space-saving integration into complex systems and are becoming increasingly important in assembly and connection technology. These are key factors that contribute to increasing the efficiency of these components. They have a high level of functional integration, as they can act as a damping element and tolerance compensation in addition to making contact, for example.

  • Automation of an electroplating shop with JSPS - Jentner Smart Plating System

    Marcel Selinger

    C. Jentner


    Description:


    JSPS is a web-based software for the automation of manual coating processes in rack and barrel electroplating, especially for contract electroplating with a large variety of workpieces. Developed over five years, the system is now patented and is being continuously developed.


    Transmitting UWB (UltraWideBand) tags and stationary antennas are used for seamless product carrier tracking, creating a kind of indoor GPS. This not only enables real-time localisation, but also the automatic triggering of processes - e.g: Booking in the goods carriers, activating peripheral devices and rectifiers.


    Our software checks that the process steps are being followed correctly, sends warning and fault messages to the employees via smartphone and supports or guides them digitally through the process with the help of LED strips and HMI panels.


    All recorded data flows into a data lake to enable big data analyses and pattern recognition for anomalies. In addition, we provide the relevant process data in a digital production file for the customer on request.

  • Thunderbolt & USB-C: The Power Duo of High-Speed Connectivity

    Andreas Pitzl

    Emerson


    Description:

    In this talk, we take a brief look at Thunderbolt and USB-C and examine how these two technologies together contribute to the dynamics of modern high-speed interfaces. The USB-C connector has established itself as a universal and versatile connector that combines not only data transfers, but also video and power transfers in a single connector. This physical uniformity has led to widespread acceptance in the electronics industry and enabled standardisation. While USB-C is the form factor that provides the physical connection, Thunderbolt provides superior performance in the background. Thunderbolt, driven by the collaboration between Intel and Apple, utilises the USB-C connector and extends its functionality with impressive data transfer rates of up to 40 Gbps and the ability to daisy-chain multiple devices.


    We examine the technical advantages of this power duo - from its high speed and versatility to its practical application in modern laptops, desktops and docking stations. A special focus is placed on the USB-C connector itself, whose suitability as a universal connection brings numerous advantages for both consumers and manufacturers. We also take a look at the future of high-speed interfaces and how Thunderbolt and USB-C will continue to drive innovation. This presentation will provide a technical overview, real-world examples and highlight the synergy effects that the interaction of Thunderbolt and USB-C enables.

  • Sustainable electroplating solutions: tin plating

    Dr. Bernd Roelfs

    MKS Instruments, Inc.


    Description:

    Tin is the ideal surface for electrical contacts if parts need to be soldered, crimped or bolted together and has thus become the contact material for connectors. The standard process to deposit Tin on copper based materials is a galvanic process mostly applied in conveyorized high speed tools or in rack and barrel tools. Many applicators are using established tin plating processes, often in use for decades. 

    Traditionally, Tin electrolytes comprise a whole set of specific chemical additives, some of which are now under scrutiny by European and non European government agencies for their hazardous potential like PFAS, Siloxanes and BPA. Other substances as Pyrocatechol, used to prevent Tin 4+ precipitates, are suspected to be cancerogenic and mutagenic. 

    We are demonstrating with this paper that it is possible to develop and apply fully sustainable Tin electrolytes and tin protection processes with ingredients that 

    • are fully compliant with known and anticipated regulations (known future bans) 
    • pose a significantly lower health risk by avoiding cancerogenic or mutagenic additives 
    • fullfill all the technical requirements such as low whisker propensity, appearance, surface distribution, process stability and solderability  

    in direct comparison to established but non sustainable electrolytes.

  • Ethernet Anywhere, how hybrid connector systems are changing automation

    Manuel Rüter

    TE Connectivity Industrial GmbH


    Description:


    One Cable Automation, cabling sharing or hybrid technology - although these terms refer to fundamentally different technologies, the terms are often used today for one and the same end product: "The combination of power and data transmission in one solution". Various solutions on the market can be used as an example here. This technology is currently undergoing significant development.  Whether fibre optic-based or copper, hybrid systems are increasingly conquering the industrial environment. In the past, specific applications or niches were a field of application for such technologies, but the advantages and the issue of sustainability are bringing about a change in established areas. One key to the breakthrough is the broad acceptance of Ethernet as a basis for communication. Standardised communication facilitates implementation and opens up new applications and markets. Extensive innovations are in the pipeline, particularly in the area of widely established metric circular connectors, which are widely represented on the market. The M12-M40 ranges are particularly noteworthy here.


    These innovations are in line with technological topics such as Single Pair Ethernet as well as further developments to the M12 Y code. The first customer implementations and user organisations are already waiting for the launch of these new technologies. The article covers both the technical aspects of the new connector technology, the current standardisation driven by TE as well as the application benefits and the genesis through customer requirements.

  • Nickel phosphorus: A challenge for X-ray fluorescence measurement technology. Or is it?

    Dr. Konstantinos Panos

    Helmut Fischer GmbH Institut für Elektronik und Messtechnik


    Description:


    Nickel phosphorus (NiP) is known as a hard, non-magnetic and corrosion-resistant diffusion barrier from PCB technology and is increasingly being used in connectors. In contrast to PCBs, however, the demands on the measurement technology for plug contacts are higher. For example, the ability to measure the phosphorus content on the smallest measuring spots is required. The phosphor fluorescence line is difficult to excite with the X-ray fluorescence measuring devices typically used for connectors and is strongly absorbed both in the air and at the detector window. X-ray tubes with a chromium anode lead to significant improvements: Measuring time and measured value scatter can be reduced. However, what is good for phosphorus determination is not necessarily advantageous for other measurement tasks. We therefore want to take a holistic view of the chromium tube and, in addition to NiP, also investigate other typical measurement tasks for connectors in comparison to tungsten tubes.

  • Contact springs as a mechatronic component

    Dr. Benjamin Hertweck

    KERN LIEBERS GmbH & Co. KG


    Description:


    Springs in various forms are increasingly being used in electromechanical applications. The preferred material here is stainless steel, which, however, has relatively poor electrical conductivity. Such electrical contacts are therefore limited in their current carrying capacity. One state-of-the-art solution is to use an additional contact element. The KERN LIEBERS Group is therefore pursuing a development approach based on high-performance copper alloys as stainless steel substitutes in order to be able to use various spring elements as a direct conductive element. Helical compression springs, wave springs and annular springs are spring designs that are used in various applications. These different types enable customised contacting solutions depending on the installation space or load spectrum. Helical compression springs are cylindrical springs that primarily work under compressive load. Wave springs are a space-optimised alternative. Ring springs, on the other hand, consist of one or more concentric rings and offer a high load capacity under axial and radial loads.

    Miniaturisation is also playing an increasingly important role in the development of springs. Particularly in electromechanical applications, miniaturised springs allow space-saving integration into complex systems and are becoming increasingly important in assembly and connection technology. These are key factors that contribute to increasing the efficiency of these components. They have a high level of functional integration, as they can act as a damping element and tolerance compensation in addition to making contact, for example.

  • Automation of an electroplating shop with JSPS - Jentner Smart Plating System

    Marcel Selinger

    C. Jentner


    Description:


    JSPS is a web-based software for the automation of manual coating processes in rack and barrel electroplating, especially for contract electroplating with a large variety of workpieces. Developed over five years, the system is now patented and is being continuously developed.


    Transmitting UWB (UltraWideBand) tags and stationary antennas are used for seamless product carrier tracking, creating a kind of indoor GPS. This not only enables real-time localisation, but also the automatic triggering of processes - e.g: Booking in the goods carriers, activating peripheral devices and rectifiers.


    Our software checks that the process steps are being followed correctly, sends warning and fault messages to the employees via smartphone and supports or guides them digitally through the process with the help of LED strips and HMI panels.


    All recorded data flows into a data lake to enable big data analyses and pattern recognition for anomalies. In addition, we provide the relevant process data in a digital production file for the customer on request.

  • Thunderbolt & USB-C: The Power Duo of High-Speed Connectivity

    Andreas Pitzl

    Emerson


    Description:

    In this talk, we take a brief look at Thunderbolt and USB-C and examine how these two technologies together contribute to the dynamics of modern high-speed interfaces. The USB-C connector has established itself as a universal and versatile connector that combines not only data transfers, but also video and power transfers in a single connector. This physical uniformity has led to widespread acceptance in the electronics industry and enabled standardisation. While USB-C is the form factor that provides the physical connection, Thunderbolt provides superior performance in the background. Thunderbolt, driven by the collaboration between Intel and Apple, utilises the USB-C connector and extends its functionality with impressive data transfer rates of up to 40 Gbps and the ability to daisy-chain multiple devices.


    We examine the technical advantages of this power duo - from its high speed and versatility to its practical application in modern laptops, desktops and docking stations. A special focus is placed on the USB-C connector itself, whose suitability as a universal connection brings numerous advantages for both consumers and manufacturers. We also take a look at the future of high-speed interfaces and how Thunderbolt and USB-C will continue to drive innovation. This presentation will provide a technical overview, real-world examples and highlight the synergy effects that the interaction of Thunderbolt and USB-C enables.

  • Sustainable electroplating solutions: tin plating

    Dr. Bernd Roelfs

    MKS Instruments, Inc.


    Description:

    Tin is the ideal surface for electrical contacts if parts need to be soldered, crimped or bolted together and has thus become the contact material for connectors. The standard process to deposit Tin on copper based materials is a galvanic process mostly applied in conveyorized high speed tools or in rack and barrel tools. Many applicators are using established tin plating processes, often in use for decades. 

    Traditionally, Tin electrolytes comprise a whole set of specific chemical additives, some of which are now under scrutiny by European and non European government agencies for their hazardous potential like PFAS, Siloxanes and BPA. Other substances as Pyrocatechol, used to prevent Tin 4+ precipitates, are suspected to be cancerogenic and mutagenic. 

    We are demonstrating with this paper that it is possible to develop and apply fully sustainable Tin electrolytes and tin protection processes with ingredients that 

    • are fully compliant with known and anticipated regulations (known future bans) 
    • pose a significantly lower health risk by avoiding cancerogenic or mutagenic additives 
    • fullfill all the technical requirements such as low whisker propensity, appearance, surface distribution, process stability and solderability  

    in direct comparison to established but non sustainable electrolytes.

Poster Slam Award Ceremony and Get Together at the VCC Vogel Convention Center

We end the day with finger food, cold drinks and plenty of time to network with participants, speakers and exhibitors.

sponsored by

Tuesday, May 27, 2025 - User Congress Day 1

(Event hall "Shedhalle")

Registration of participants at the Vogel Convention Center (VCC)

Welcome to the first day of the Connector User Congress

Listen to lectures from experts on the following topics:

  • Single Pair Ethernet
  • Electrical interfaces
  • Simulation
  • New technologies

Kristin Rinortner

ELEKTRONIKPRAXIS

Keynote Speech

On the cutting edge of new ideas - innovation management in connection technology

  • >> learn more

    Dr. Susanne Krichel will give a detailed insight into innovation management at LAPP in her short presentation "On the pulse of time for new ideas - innovation management in fastening technology". The innovation management function was introduced more than a decade ago in order to realise LAPP's "Top of mind" vision. Today, the function is a central part of the global R&D structure. The presentation introduces two central management concepts of LAPP Innovation Management and gives an insight into the different formats, processes and the toolbox. The presentation not only highlights the theoretical approaches, but also provides concrete insights into practice.

Dr. Susanne Krichel

Senior Vice President Global R&D (from April 1, 2025)  | Lapp Holding SE

Focus: Single Pair Ethernet

Convergence in SPE Connectivity using PROFINET as an example

  • >> learn more

    A year ago, the Profibus User Organisation (PNO) initiated a process in the "Cabling and Interconnection Technology" working group with the decision to use the IEC 63171-7 variant as the basis for a standardised SPE connector, which led to an overwhelming dynamic. Within a year, it was possible to develop a joint concept that will be transferred to international standardisation. The great support from many manufacturers shows the great need for standardisation of SPE connectors. There is now an opportunity to utilise all the experience gained from existing concepts in order to create a truly future-proof concept. Large users are reacting positively, as investment decisions for SPE are now much more secure. The presentation from the neutral perspective of the PNO working group leader is an invitation to manufacturers to help shape the new standard for SPE, not only at the connector level, but also as PROFINET system cabling, and with its application focus is aimed at users who can thus understand how SPE can be seamlessly embedded as a physical layer in PROFINET.


    What you will learn in the presentation:


    • Presentation of the future IEC 63171-7 connector family
    • Roadmap for implementation in the context of PROFINET
    • Unique position of the existing concept in relation to the PROFINET application areas

Andreas Huhmann

PROFIBUS & PROFINET International

Harald Müller

PROFIBUS & PROFINET International

The unified SPE connector – status and implications for users

  • >> learn more

    As part of SPS 2024, the PROFIBUS & PROFINET User Organisation (PNO) has presented a new connector system for PROFINET via SPE. This connector face is based on the data element from the SPE M12 hybrid of the IEC 63171-7 standard. The standardised connector face is intended to provide clarity and security for end users in industrial communication and give the technology the long-awaited boost. To this end, cross-manufacturer standardisation activities have been launched and other user organisations from the industrial environment have been involved. SPE variants are also included in the new hybrid standardisation IEC 61076-2-117. Until now, there has been a lack of IEC standardisation in the area of large, metric circular connectors, which is now covered by this standard and will drive the market penetration of single-cable solutions. The presentation will provide an overview of current standardisation activities, the status of productisation and a picture of acceptance of the new connector family. In addition, new markets for Single Pair Ethernet and the potential for further applications will be identified and evaluated.


    You will learn this in the lecture:

    • Current status of the normative situation
    • Productisation and product diversity in SPE
    • The added value of SPE based on specific use cases

Tim Kindermann

PHOENIX CONTACT GmbH & Co. KG

Thomas Keller

Rosenberger Hochfrequentechnik GmbH & Co. KG

Coffee break and exhibition

Focus: Electrical Interfaces

Laser Structuring of Stamping Grids for Media Tight Connectors for Battery Packs, Power Electronics and Cooling Systems for E-Drives

  • >> learn more

    Latest developments in manufacturing technologies of metallic parts deliver a large number of new possibilities for packaging of battery packs, power electronics and cooling systems for e-drives. The contribution deals not only with technological benefits but also with commercial aspects and high-quality mass production. State of the art media tight injection moulding is connected to a two-step moulding process. In the first step, the metallic stamping grid is joined with a thermoplastic injection process. In a second injection process, a cost intensive special material, e.g. based on silicone, is used to improve media tightness. Alternative processes have been developed in the last years. The first approach deals with a pre-heating of the metal part before the injection process. The second approach uses a bonding agent on the surface of the metal part to enhance the adhesion of the polymer on the metal part. Both approaches show disadvantages in the context of reproducibility and mass production. On the one hand, the realization of small temperature tolerances in a high cycle time process, where the parts are moved in a roll-to-roll process, is connected to high expenses. On the other hand, the realization of homogeneous bond coatings is complex to measure. The here presented approach describes a laser structuring process of the metallic stamping grid in front of the in-mould assembly process. Thereby media tightness is generated by realizing a labyrinth seal at the plastic metal interface. This work first presents the feasibility of the sealing technology, with samples generated at industrial plants and examined at leak test benches. Scanning electron microscopy was used to determine the surface and interface properties. Following this, the corresponding production technology, which is applicable in a line injection process, is presented.

Dr. Benjamin Hertweck

KERN LIEBERS GmbH & Co. KG

USB-C 3.1 as an intelligent power supply and charging interface

  • >> learn more

    The USB-C interface combines data rates of up to 10 Gbit/s with a power transfer of up to 100 W for charging a wide range of mobile devices. In addition, the USB-C connector and the USB power delivery communication protocol (USB-PD) enable fast charging with an output of up to 240 W and support adaptive charging at the same time. In addition, the IEC 62680-1-3:2022 standard defines the electromechanical components that are compatible with the existing electrical and functional specifications of the USB interface - including the USB power delivery interface. Careful design of the interface is essential both to ensure signal integrity and to minimise electromagnetic interference. The presentation will explain what to look out for in the layout, but also in the individual components of the new USB cable/connector solution - for example in existing cable assemblies and adapters or in USB Type-C-based device recognition and interface configuration - and show possible solutions. It will also show which conformity measurements need to be carried out and how helpful a short-circuit adapter can be.

Fabian Altenbrunn

Würth Elektronik eiSos GmbH & Co. KG

Everything on the PCB: Challenges and solutions for circular connectors

  • >> learn more

    In this presentation, we will shed light on the technical challenges and solutions in the development of various circular connectors for use on printed circuit boards. We will provide insights into the realisation of the M8 SMD, M12 reflow and a new, pick-and-place-capable M12 connector in a compact design with angled contacts. With the "S15 bayonet" variant, particular attention is paid to the technical design of the clearance and creepage distances, especially in this size (pitch and rated voltage). With the M17 THR, the first standardised connector in the field of PCB connectors above size M12, and the M23 Hybrid, we are demonstrating how we can meet the increasing demand for solutions and at the same time improve efficiency and reliability for users. By combining customer-specific requirements, innovative ideas and application-orientation, a comprehensive overview of the latest developments in circular connectors will be presented.

Patrick Schmidt

PHOENIX CONTACT GmbH & Co. KG

Lunch break and exhibition

SPOTLIGHT STAGE

1:10 - 1:25 pm

High speed connector manufacturing

  • >> learn more

    High-speed production machines from ring material to connectors

presented by

1:25 - 1:40 pm

5 steps to increase your competitive advantage with precision moulding tools

  • >> learn more

    The presentation will cover the main challenges in the use of precision moulding tools, such as vibration, wear and machine performance, as well as maintaining tolerances in the single-digit µm range. By utilising accuracy, ease of use and automation, these challenges are successfully overcome, resulting in significant competitive advantages. The five steps presented offer practical solutions to maximise the efficiency and performance of precision moulding tools.

presented by

Ingo Böhm | Senior Sales Manager

Parallel Workshops 

(VCC seminar rooms)

Workshop 1: Measurement system analysis to optimize quality controls using X-ray fluorescence analysis (XRF)

Dr. Konstantinos Panos | Helmut Fischer GmbH

Omar Cheikh-Jumaa | Helmut Fischer GmbH

Focus: Checking & Testing

  • >> learn more

    What you will learn:


    • Basics of statistics and measurement system analysis
    • Basics and influencing factors of X-ray fluorescence analysis 
    • Intervention options on the XRF device

    Modern production is characterised by high quality standards combined with high throughput. It is not only necessary to optimise the production processes in terms of quality and throughput, but also the inspection and measurement processes. Measurement system analysis (MSA) provides valuable information and indications of possible optimisation measures for testing and measurement technology. As MSA is often requested and carried out anyway, recommendations for further optimisation can be derived without additional effort. However, this also requires an understanding of the interrelationships, which we would like to shed some light on here. For a better understanding, we will first go into the relevant basics of statistics and measurement system analysis. Influencing factors for the measurements with the X-ray fluorescence analyser are discussed and the connection with the MSA is established. Accuracy and scattering can be considered individually for an XRF analyser. This results in relevant conclusions for optimisation. The aim of the workshop is to enable you to carry out the optimisation shown on your measuring device.

Workshop 2: Success in new markets through leak testing of connectors

Dr. Joachim Lapsien | CETA Testsysteme GmbH

Focus: Checking & Testing

  • >> learn more

    What you will learn:


    • Leak testing | Type testing versus routine testing
    • Leak testing during production using compressed air as the test medium 
    • Adaptation of connectors | Practical tips | Optimisation options

    Current market trends such as the energy transition, e-mobility and medical technology are placing new demands on connectors. In electromobility in particular, they must function reliably in charging infrastructures, power controls and thermal management systems. In renewable energies, they are often used outdoors - for example in power distribution, signal transmission and the control of wind power and photovoltaic systems. Medical technology applications also require absolutely fault-free operation. Innovative developments such as multifunctional and intelligent connectors with integrated electronics are setting new standards. To minimise risk, tightness against moisture and liquids is tested. A distinction is made between type testing in the laboratory on prototypes or prototypes (IP protection class testing) and end-of-line piece testing in the production process, when every product has to be tested. The requirements for the leak test vary depending on the connector type - whether as a single product, plugged-in unit or installed in a system. Based on the basics of industrial leak testing with compressed air as the test medium, this workshop presents a practical guide for leak testing different types of connectors.

Workshop 3: Flexible and precise manufacturing of connectors

Kay Wesendrup | Otto Bihler Maschinenfabrik GmbH & Co. KG

Focus: Manufacturing

  • >> learn more

    The aim of the workshop is to show participants various options for the flexible and precise production of connectors. This includes, for example, production-orientated design, the requirements for production equipment, innovative tool solutions and the possibilities of inline testing on the production line. The production of "simple" connectors on the assembly line through to the fully automated production of complex, assembled connectors including packaging will be presented. Special attention will be paid to the modularisation and scalability of the corresponding system and tool solutions. The workshop will be organised using practical examples. In addition to the classic stamped and assembled connectors, another focus will be on stitched connectors. There will also be practical examples of this. Participants will be able to see the bigger picture of connector development. After all, innovative developments always require innovation in production technology. These ultimately lead to commercial success.

Workshop 4: Choosing the right surface coating for contact materials

Markus Klingenberg | TE Connectivity Germany

Focus: Coating technology

  • >> learn more

    Electroplating makes a significant contribution to the correct functioning of a component and is therefore a very important functional component. Among other things, it can also have a major influence on further processing, utilisation and, if precious metals are used, above all on costs.

     It is therefore all the more important to choose an optimum coating. But what does optimum mean? This covers several factors, such as the coating metal and the appropriate coating thickness at the functional location. Starting with the right choice of base material, suitable design, etc., many other influences must be collated, evaluated and ultimately taken into account accordingly. Current load, type of further processing, assembly and connection technology, corrosion and temperature loads in the field, etc. are just a few important points that can lead to failure of the coating and ultimately the component function if not taken into account.  The workshop will show you which questions you can ask yourself to optimise your coating or at least approach potential suppliers in a targeted manner.


    Important issues are, for example:


    • How and how often is the functional area loaded? => mating cycles, forces, tribology, ...
    • How is the electrical connection of the component designed? => Crimping, soldering, welding...
    • Further processing steps and later place of use in the field => chronic or temporary temperature loads, corrosive environment

    Furthermore, the workshop will also show examples where this was not done and failures occurred. Questions and problems relating to your upcoming or current projects and components are welcome.

Workshop 5: EMC-compliant design and use of connectors

Dr.-Ing. Helmut Katzier | Engineering office for assembly and connection technology

Focus: EMC

  • >> learn more

    What you will learn:


    • Sources of interference and electromagnetic coupling
    • EMC-compliant design of devices and optimised connectors
    • Rules for selecting connectors

    Connectors are also critical components in all electronic devices and systems in terms of EMC. EMC is determined by several sources of interference and electromagnetic coupling. These interference sources and couplings are explained using practical examples. The design and correct use of connectors play an important role in the EMC-compliant design of devices and systems. These two aspects will be demonstrated in the workshop using current connector designs. Even with a connector that is optimised in terms of EMC, EMC interference can be generated if the user makes an unfavourable connection. In the workshop, EMC rules for selecting the correct connectors and the correct connections to the PCB and cable are presented.

Workshop 6: Qualification of cable assemblies for industrial applications: How connectors and cables find each other.

Joachim de Buhr  |  Euroconnectors
Werner Häring | Euroconnectors

Focus: Cable assembly

  • >> learn more

    What you will learn:


    • Assessment of technical requirements, processes and quality characteristics and their cost-effectiveness
    • Interactive practical exercises anchor new skills under expert guidance (materials are provided).

    Participants will gain a well-founded, comprehensive and detailed insight into the parameterisation of sophisticated cable assemblies (KKF) based on the generic process model: material selection, process qualification, production, quality assurance and cost optimisation. Both worlds are brought together: Cable and connector perspectives are presented in a practical and clear manner.


    Procedure and technical details

    1. Familiarisation with the basic parameters of cables and connectors: environment, use, electrical properties (optional EMC, requirements and life cycle)
    2. Design drivers of the connection in relation to production (Cables: transmission types, designs, contacting, ambient temperature, certifications, application categories, core types, etc.; Connectors: designs, connection types, contacting, environmental influences, EMC requirements, standards and other quality requirements; Qualification procedures in the test programme in accordance with EN 60352-2 (contact resistance, micrographs, crimp force determination, pull-off tests, crimp height measurement)
    3. Characteristics of good KKF drawings and avoiding errors: Interaction and practical exercise
    4. Learn about alternative connection techniques and be able to professionally categorise them with their advantages and disadvantages: Ultrasonic compaction (technology and active principle, application examples and procedure process, quality characteristics according to IPC/WHMA-A-620C
    5. Definition of electrical series testing according to IPC/WHMA-A-620C: Being able to see and assess important test parameters
    6. KKF documentation and visual work plan: Overview of professional work preparation and compiling documentation
    7. Typical sources of error in CCF (interaction and practical exercise)
    8. Understand and calculate industrial process capability, learn about value analysis and be able to assess it for your own use cases

Short coffee break and exhibition

Focus: Simulation

Electrical clearance and creepage distance analysis with AutoCrear

  • >> learn more

    Electrical assemblies contain networks of different voltages, between which short circuits can form either by sparkover through the air (air gap) or via the surfaces of insulators (creepage distance). The AutoCrear tool offers a robust and efficient software-based analysis of all clearances and creepage distances based on the CAD data of electrical assemblies. For the first time, developers of electrical assemblies now have a robust tool at their disposal to recognise all standard violations as early as the design phase. Comprehensive and standardised documentation regarding clearances and creepage distances is created automatically. AutoCrear is a standalone solution that combines the complete workflow of a clearance and creepage distance analysis in a single programme. From 2025, 3D analysis of PCBs in combination with mechanical components will also be possible.

  • >> learn more

    Electrical assemblies contain networks of different voltages, between which short circuits can form either by sparkover through the air (air gap) or via the surfaces of insulators (creepage distance). The AutoCrear tool offers a robust and efficient software-based analysis of all clearances and creepage distances based on the CAD data of electrical assemblies. For the first time, developers of electrical assemblies now have a robust tool at their disposal to recognise all standard violations as early as the design phase. Comprehensive and standardised documentation regarding clearances and creepage distances is created automatically. AutoCrear is a standalone solution that combines the complete workflow of a clearance and creepage distance analysis in a single programme. From 2025, 3D analysis of PCBs in combination with mechanical components will also be possible.

Urs Simmler

Aveniq AG

EMC and the simulation that nobody actually wants to do

  • >> learn more

    Electromagnetic compatibility (EMC) is an essential topic in modern electronics development. However, it is often perceived as a necessary "evil" - an area that only receives attention when problems arise. The simulation of EMC effects in particular is often neglected. But why is this the case? The challenges lie in the complexity and the seemingly low priority. Simulations are time-consuming, require specialised tools and in-depth knowledge of physical interactions. In addition, many projects focus on functionality and market readiness, which means that EMC aspects are often pushed to the end of the development process - often with costly consequences. This presentation shows how simulations can help to recognise and solve EMC problems at an early stage. Practical examples and efficient approaches will illustrate why it is worth doing the simulation that nobody wants to do.


     What will you learn in the presentation?

    • Why EMC simulation is often neglected - and what risks this harbours.
    • How simulations help to recognise and solve EMC problems at an early stage.
    • Practical approaches for efficient and targeted EMC simulation in connection technology

Maximilian Depta

Simuserv GmbH

Coffee break and exhibition

Focus: New Technologies

Latest technologies in the metal recycling economy of the connector industry

  • >> learn more

    Currently, mixed fractions are usually processed when recycling precious and non-precious metals. These consist of finished/semi-finished applications (e.g. plugs, cables, relays, coils, circuit boards) as well as metallic recyclable materials from the manufacture of these products (e.g. precious or base metal stamping waste, plastic composite materials). These scraps very often contain impurities or are not optimally prepared for processing. As a result, they make metal refining more expensive and reduce the yield of metals, resulting in high monetary losses. In order to ensure highly efficient refining, the metals must be fed into the processes as pure as possible and without impurities. In order to obtain such pure - state of the art - fractions, the latest developments in cutting-edge technologies in the field of fully automated separation and sorting technology will be presented, the results discussed and the advantages over conventional refining demonstrated. With this state-of-the-art separation/sorting, metal and plastic composite scrap can be recycled in a more sustainable, cost-effective, energy-efficient and CO2-reduced way compared to current processes. This latest technology is therefore pioneering for the circular economy in the connector industry.



    What will you learn in the lecture:


    • Climate-neutral recycling of connectors and recyclable materials from their production
    • Sustainable metal refining through intelligent separation of recyclable materials
    • Energy-efficient and CO2-reduced processing of composite materials (metal/plastic)

Thomas Frey

Silverteam Recycling GmbH

On the brink of the future: How the connector industry shapes the AI revolution

  • >> learn more

    Artificial intelligence is rapidly transforming the technological landscape, pushing the limits of digital infrastructure. While North America and Asia are making massive investments in AI data centers, Europe often remains a consumer rather than an innovator. However, there is one area where Europe has the potential to take the lead: the physical infrastructure of AI – particularly high-speed connectivity and connectors.

    This presentation will explore the technological demands that AI data centers face today and in the future. The exponential increase in data rates, rising power consumption, and the need for advanced cooling solutions present major challenges—but also significant opportunities. What innovations are necessary to minimize signal degradation, improve energy efficiency, and build a reliable AI infrastructure?

    Beyond physical infrastructure, a fundamental question arises: What is the value of state-of-the-art AI data centers if Europe does not develop its own AI-driven products? The foundation for AI must not only be built—it must also be utilized. This talk will highlight how European companies can strategically position themselves to not only be affected by the AI revolution but to actively participate in shaping it.


    You will learn this in the presentation:


    • What role connectors play in AI applications.
    • What requirements AI data centres place on connectors.
    • Why simple, robust and standardised solutions are crucial.

Lars Klapproth

Heilind Electronics GmbH

Summary and information about the evening event

Kristin Rinortner

ELEKTRONIKPRAXIS

Wednesday, May 28, 2025 - User Congress Day 2

(Event hall "Shedhalle")

Registration of participants at the Vogel Convention Center

Welcome to the second day of the Connector User Congress

Listen to lectures from experts on the following topics:

  • Automotive
  • Materials and coatings

Kristin Rinortner

ELEKTRONIKPRAXIS

Focus: Automotive

Reliability engineering for automotive connectors – Risks and opportunities at the same time

  • >> learn more

    Determining reliability values for automotive connectors is a challenging but also promising task. Connectors are essential components in the automotive industry as they establish electrical connections between different systems and components. Their reliability is crucial for the safety and functionality of the vehicle.  Determining this reliability is technically demanding. One of the toughest requirements for connectors is the extreme environmental conditions to which they are exposed in the vehicle: high temperatures, humidity, vibrations and chemical influences. In order to determine reliable reliability values for real applications, tests must be defined and carried out in such a way that they realistically represent real application scenarios.


    What will you learn in this lecture?


    •  Safety vs. reliability
    •  Accelerated ageing and its limits
    •  Systematic and statistical faults in connectors

Dr. Frank Ostendorf

TE Connectivity Germany

Ultrasonic welding of Al busbars to Cu contacts: The role of laser structuring and connection reliability in meeting IEC 60352-9 standards

  • >> learn more

    This study specifically addresses the challenges of ultrasonic welding (USW) to create connections between aluminum busbars and copper contacts in accordance with the quality standards defined by IEC 60352-9. This standard outlines the requirements for ultrasonically welded connections used in high reliability electronic assemblies. Our research focuses on the effects of film contamination and surface topography optimization on weld efficiency and durability. We highlight the detrimental effect of film contaminants on the electrical and mechanical stability of interconnects and show how optimized surface topography, achieved by laser structuring, plays a key role in improving weld strength. In addition, our research includes the analysis of intense vibrations during the USW process through simulations, highlighting the potential material degradation, especially when joining Al busbars to Cu contacts. The application of laser structuring for surface preparation is shown to be a critical factor in minimizing adverse effects and ensuring the integrity and performance of electrical contacts. Our results underscore the need for precise process control and advanced surface preparation techniques to meet the standards set by IEC 60352-9 and improve the reliability of electrical interconnection manufacturing.

Christian Gregor

Schaltbau GmbH

Forming limits and maximum formabilities of metallic materials for connectors in the automotive industry

  • >> learn more

    The automotive industry places high demands on the mechanical and electrical properties of connectors. In addition to the functional requirements of the contact, the formability of the metallic materials in particular plays a decisive role. This influences not only the manufacturability of the connectors, but also their reliability and durability in operation.

    The maximum formability of strip materials and thus their deformation capacity is shown in the forming limit curve. This enables the evaluation of forming processes for the presence of material necking and thus failure. The forming limit curve is a valuable instrument in method planning and toolmaking and is used to optimise forming tools and component geometries. In the manufacture of connectors, it is crucial that the materials neither fail during forming nor exhibit excessive surface roughening or microcracks, which can lead to malfunctions during subsequent use. Due to the often complex geometries, several forming steps and precise manufacturing techniques are required. The choice of material with the optimum strength and microstructure is of central importance. To summarise, the maximum formability of metallic materials is a decisive factor for the development, functionality and production of connectors in the automotive industry. A detailed analysis and in-depth understanding enable the performance and reliability of connectors to be maximised and thus contribute to the safety and efficiency of modern vehicles.


    You will learn this in the lecture:


    • Basic knowledge of the forming limit diagram 
    • Experimental determination of the forming limit curve 
    • Significance of the forming limit diagram for the production of connectors

Niklas Utz

TE Connectivity Germany

Coffee break and exhibition

Focus: Materials and Coatings

Sustainable production of circular connectors: Potential of metal forming for ecological and economic benefits

  • >> learn more

    The production of connectors faces the challenge of combining ecological sustainability with productivity. In particular, the production of machined circular connectors leads to machining waste with a significant carbon footprint. Cold extrusion, on the other hand, would enable almost complete material utilisation. In order for machining design features to be substituted by forming features, a forming-compatible design is required that simultaneously ensures the functional requirements of the connectors. The question also arises as to how the extruded crimp area behaves during the crimping process. Various options for the moulding of functionally relevant features of circular connectors were investigated. After analysing representative design features, experimental tests were carried out to produce these features using cold extrusion. In addition, the crimping process of extruded crimp areas was analysed using finite element simulations in order to evaluate the crimpability as a result of the forming history. The results show that cold extrusion of circular connectors combines high productivity with a sustainable process chain.

Herman Voigts

Manufacturing Technology Institute - MTI of the RWTH Aachen

Metals and clad materials for electrical connectors in high performance applications

  • >> learn more

    Electrical connectors are used to transmit electrical energy or electrical signals. First of all, this means that the connection materials must provide good electrical conductivity and since the electrical power is also converted into heat due to the electrical resistance of the conductor materials, high thermal conductivity is also required. Depending on the environmental conditions, sufficient corrosion resistance is also one of the basic requirements. Electrical connectors are intended for use in a wide temperature range from well below freezing to over 100 °C (specific requirements depend on the application) and the operating temperature can also fluctuate constantly and unsystematically during use, which leads to further requirements such as low temperature toughness, resistance against thermal fatigue, creep and relaxation strength and thermal stability against aging. But the connector materials must also be suitable for production of the end parts by the customer (i.e. cold formability, machinability and stampability, sometimes also coatability or solderability / brazeability, low springback) and the connection must last over a long period of time and even after several mating cycles under harsh environmental conditions (including vibration and the resulting need to prevent friction fatigue). Finally, some applications, for example medical devices, may have special requirements, for example regarding biocompatibility.

    The more demanding the application is in terms of these requirements, the more sophisticated connection materials are required. Consequently, the highest requirements for aerospace and defense, drilling technologies and subsea must be met. Beryllium copper, nickel and tantalum alloys have proven particularly useful under these conditions. Clad metals are also becoming more and more important there. The presentation will highlight the outstanding properties of the materials mentioned. Typical application examples of these materials will be given. So, it becomes clear that high-performance materials such as beryllium copper remain indispensable for the coming megatrends and can exploit their potential even more when combined with technologies such as cladding.

Dr. Björn Reetz

Materion Brush GmbH

Aging of plastics in terms of dielectric strength and tracking resistance

  • >> learn more

    We will begin by reviewing the fundamentals of the standards that define dielectric strength and tracking resistance. This includes understanding the values, units, and tests associated with these concepts. Key terms such as CTI (Comparative Tracking Index), RTI (Relative Temperature Index), and pollution degree will also be revisited.


    Next, we will explore the factors that contribute to the aging of plastics, including exposure to sunlight, moisture, temperature, and pollution.


    We will examine the impact of moisture on tracking breakdown voltage and analyze how partial discharges within air bubbles in plastics affect their performance. Test results will be presented to illustrate how manufacturers design products with adequate breakdown safety margins to ensure long-term electrical reliability.


    Finally, we will assess how temperature influences the degradation of plastics and their dielectric strength over time.


    What will you learn in the lecture?


    • Ageing influence on plastic
    • Plastic dielectric strength
    • Tracking resistance

Alexandre Chaillet

Würth Elektronik eiSos GmbH & Co. KG

Summary and Outlook 2026

Kristin Rinortner

ELEKTRONIKPRAXIS

Lunch break and exhibition

SPOTLIGHT STAGE

1:20 - 1:35 pm

What VAD really means

  • >> learn more

    The presentation explains how Heilind, as a Value-Added Distributor (VAD), goes beyond standard distribution by offering part assembly, customization, flexible deliveries, and tailored support—especially vital in fast-moving sectors like Mil/Aero.

presented by

Oliver Fleschhut | European Mil/Aero Product Team Leader

Parallel Workshops 

(VCC seminar rooms)

Workshop 1: Measurement system analysis to optimize quality controls using X-ray fluorescence analysis (XRF)

Dr. Konstantinos Panos | Helmut Fischer GmbH

Omar Cheikh-Jumaa | Helmut Fischer GmbH

Focus: Checking & Testing

  • >> learn more

    What you will learn:


    • Basics of statistics and measurement system analysis
    • Basics and influencing factors of X-ray fluorescence analysis
    • Intervention options on the XRF device

    Modern production is characterised by high quality standards combined with high throughput. It is not only necessary to optimise the production processes in terms of quality and throughput, but also the inspection and measurement processes. Measurement system analysis (MSA) provides valuable information and indications of possible optimisation measures for testing and measurement technology. As MSA is often requested and carried out anyway, recommendations for further optimisation can be derived without additional effort. However, this also requires an understanding of the interrelationships, which we would like to shed some light on here. For a better understanding, we will first go into the relevant basics of statistics and measurement system analysis. Influencing factors for the measurements with the X-ray fluorescence analyser are discussed and the connection with the MSA is established. Accuracy and scattering can be considered individually for an XRF analyser. This results in relevant conclusions for optimisation. The aim of the workshop is to enable you to carry out the optimisation shown on your measuring device.

Workshop 2: Success in new markets through leak testing of connectors

Dr. Joachim Lapsien | CETA Testsysteme GmbH

Focus: Checking & Testing

  • >> learn more

    What you will learn:


    • Leak testing | Type testing versus routine testing
    • Leak testing during production using compressed air as the test medium 
    • Adaptation of connectors | Practical tips | Optimisation options


    Current market trends such as the energy transition, e-mobility and medical technology are placing new demands on connectors. In electromobility in particular, they must function reliably in charging infrastructures, power controls and thermal management systems. In renewable energies, they are often used outdoors - for example in power distribution, signal transmission and the control of wind power and photovoltaic systems. Medical technology applications also require absolutely fault-free operation. Innovative developments such as multifunctional and intelligent connectors with integrated electronics are setting new standards. To minimise risk, tightness against moisture and liquids is tested. A distinction is made between type testing in the laboratory on prototypes or prototypes (IP protection class testing) and end-of-line piece testing in the production process, when every product has to be tested. The requirements for the leak test vary depending on the connector type - whether as a single product, plugged-in unit or installed in a system. Based on the basics of industrial leak testing with compressed air as the test medium, this workshop presents a practical guide for leak testing different types of connectors.

Workshop 3: Flexible and precise manufacturing of connectors

Kay Wesendrup | Otto Bihler Maschinenfabrik GmbH & Co. KG

Focus: Manufacturing

  • >> learn more

    The aim of the workshop is to show participants various options for the flexible and precise production of connectors. This includes, for example, production-orientated design, the requirements for production equipment, innovative tool solutions and the possibilities of inline testing on the production line. The production of "simple" connectors on the assembly line through to the fully automated production of complex, assembled connectors including packaging will be presented. Special attention will be paid to the modularisation and scalability of the corresponding system and tool solutions. The workshop will be organised using practical examples. In addition to the classic stamped and assembled connectors, another focus will be on stitched connectors. There will also be practical examples of this. Participants will be able to see the bigger picture of connector development. After all, innovative developments always require innovation in production technology. These ultimately lead to commercial success.

Workshop 4: Choosing the right surface coating for contact materials

Markus Klingenberg | TE Connectivity Germany

Focus: Coating technology

  • >> learn more

    Electroplating makes a significant contribution to the correct functioning of a component and is therefore a very important functional component. Among other things, it can also have a major influence on further processing, utilisation and, if precious metals are used, above all on costs.

     It is therefore all the more important to choose an optimum coating. But what does optimum mean? This covers several factors, such as the coating metal and the appropriate coating thickness at the functional location. Starting with the right choice of base material, suitable design, etc., many other influences must be collated, evaluated and ultimately taken into account accordingly. Current load, type of further processing, assembly and connection technology, corrosion and temperature loads in the field, etc. are just a few important points that can lead to failure of the coating and ultimately the component function if not taken into account.  The workshop will show you which questions you can ask yourself to optimise your coating or at least approach potential suppliers in a targeted manner.


    Important issues are, for example:


    • How and how often is the functional area loaded? => mating cycles, forces, tribology, ...
    • How is the electrical connection of the component designed? => Crimping, soldering, welding...
    • Further processing steps and later place of use in the field => chronic or temporary temperature loads, corrosive environment

    Furthermore, the workshop will also show examples where this was not done and failures occurred. Questions and problems relating to your upcoming or current projects and components are welcome.

Workshop 5: EMC-compliant design and use of connectors

Dr.-Ing. Helmut Katzier | Engineering office for assembly and connection technology

Focus: EMC

  • >> learn more

    What you will learn:


    • Sources of interference and electromagnetic coupling
    • EMC-compliant design of devices and optimised connectors
    • Rules for selecting connectors

    Connectors are also critical components in all electronic devices and systems in terms of EMC. EMC is determined by several sources of interference and electromagnetic coupling. These interference sources and couplings are explained using practical examples. The design and correct use of connectors play an important role in the EMC-compliant design of devices and systems. These two aspects will be demonstrated in the workshop using current connector designs. Even with a connector that is optimised in terms of EMC, EMC interference can be generated if the user makes an unfavourable connection. In the workshop, EMC rules for selecting the correct connectors and the correct connections to the PCB and cable are presented.

Workshop 6: Qualification of cable assemblies for industrial applications: How connectors and cables find each other.

Joachim de Buhr | Euroconnectors
Werner Häring | Euroconnectors

Focus: Cable assembly

  • >> learn more

    What you will learn:


    • Assessment of technical requirements, processes and quality characteristics and their cost-effectiveness
    • Interactive practical exercises anchor new skills under expert guidance (materials are provided).

    Participants will gain a well-founded, comprehensive and detailed insight into the parameterisation of sophisticated cable assemblies (KKF) based on the generic process model: material selection, process qualification, production, quality assurance and cost optimisation. Both worlds are brought together: Cable and connector perspectives are presented in a practical and clear manner.


    Procedure and technical details

    1. Familiarisation with the basic parameters of cables and connectors: environment, use, electrical properties (optional EMC, requirements and life cycle)
    2. Design drivers of the connection in relation to production (Cables: transmission types, designs, contacting, ambient temperature, certifications, application categories, core types, etc.; Connectors: designs, connection types, contacting, environmental influences, EMC requirements, standards and other quality requirements; Qualification procedures in the test programme in accordance with EN 60352-2 (contact resistance, micrographs, crimp force determination, pull-off tests, crimp height measurement)
    3. Characteristics of good KKF drawings and avoiding errors: Interaction and practical exercise
    4. Learn about alternative connection techniques and be able to professionally categorise them with their advantages and disadvantages: Ultrasonic compaction (technology and active principle, application examples and procedure process, quality characteristics according to IPC/WHMA-A-620C
    5. Definition of electrical series testing according to IPC/WHMA-A-620C: Being able to see and assess important test parameters
    6. KKF documentation and visual work plan: Overview of professional work preparation and compiling documentation
    7. Typical sources of error in CCF (interaction and practical exercise)
    8. Understand and calculate industrial process capability, learn about value analysis and be able to assess it for your own use cases

End of the Connector User Congress 2025

* Subject to change

 ** Our service for participants in the basic seminars: You will receive the Practical Manual for Connectors worth €89.80.