Preliminary Agenda 2026 *

In the field of electrical connectors, numerous terms from various disciplines are used, and a precise understanding of these terms is crucial for successful collaboration between users and manufacturers. Terms such as contact overlap, relaxation, gas-tight connections, and contact corrosion are frequently employed, but their precise meanings are not always readily apparent. Particularly during fault analysis and troubleshooting, it is essential that all parties involved understand the specific aspects being discussed. This seminar explains the most important technical terms related to electrical connectors, covering all relevant areas from mechanics, electrical engineering, materials science, and qualification. Each term is presented with a precise definition, a fundamental technical explanation, and an clarification of its significance in the context of a fault. The goal of this introductory seminar is to provide participants with a glossary upon completion, enabling them to quickly and reliably look up the diverse terms used in the field of electrical connectors.

This introductory seminar provides an overview of the fundamentals of contact physics, explaining key concepts and the origins of physical quantities such as contact resistance, contact heating, and derating. These phenomena are discussed in relation to contact surfaces and contact coatings. The 'contact behavior' of a connector must be considered a system property resulting from the interaction of the contact coating, connector design, electrical load, application requirements, and environmental conditions. The seminar is divided into the following sections: Contact physics fundamentals of static contacts; Measurement and simulation of contact surfaces and materials; Contact physics comparison of standard surfaces for connectors; Contact heating and derating; Fretting corrosion; Contact behavior in relation to intermediate layers; Degradation mechanisms of connector contacts

Selecting the right copper and copper alloys is a complex topic. For many connector developers and designers, choosing the technically and commercially appropriate material is not always easy. This seminar covers all the fundamentals relevant to connectors and provides information on these semi-finished products, including insights into mechanical and physical properties, as well as a brief overview of technically relevant surface finishes, with a focus on tin. Furthermore, the presenter will offer insights into selecting critical parameters and highlighting the potential pitfalls.

Cables and wires are essential for the transmission of electrical energy, data, and signals, enabling the operation of machines, devices, and communication systems. This presentation explains key terms and the construction of a cable, including conductors, insulation, shielding, and outer sheath, and clarifies technical terms such as "core," "strand," and "sheathed cable." The difference between data and power cables is also discussed, along with their respective technical requirements. The selection of the right cable for various applications, based on temperature resistance, mechanical strength, and electromagnetic compatibility, is also addressed. Finally, current developments and future trends, such as highly flexible cables, environmentally friendly materials, and smart sensors, as well as the impact of digitalization and automation on cables and wires, are presented. This seminar provides a comprehensive overview of the importance, construction, and selection of cables and wires, as well as future developments.

This connector guide illustrates the relationships and trade-offs involved in selecting and using connectors, providing the fundamental knowledge for understanding their properties and electrical specifications. It explains basic principles, material selection during manufacturing, physical characteristics, processing techniques, and the resulting implications for function and application. The fourteen chapters cover:

• What is a connector?
• Connector components
• Connection techniques
• Insulator materials
• Contact materials
• Contact surfaces
• Contact resistance
• Shielding measures
• Connector locking mechanisms
• Housings and mechanics
• Power electronics
• High data rates
• Further processing in the manufacturing process
• Connector selection.

The chapters detail the differences and present the advantages and disadvantages of individual materials, manufacturing processes, and application methods, weighing them against each other and evaluating them. Both operating limits (current load at higher ambient temperatures) and behavior at the highest data rates are addressed. This connector guide is not intended as a purchasing aid, but rather as a compendium of the diverse properties, designs, and processing options. It shows, independently of manufacturers, which alternatives are available and what the consequences of choosing certain features are, for better or for worse.

This seminar covers the theoretical foundations and principles of electroplating. Influences on deposition and a general process sequence for coating parts complement the theoretical framework. Many prerequisites regarding the base material, product design, and material selection must be met to achieve coating quality. These are discussed in detail, and in addition to the surface finish and geometric requirements of the base material, the interaction between the base and coating materials is also explained. The functional significance, advantages, and disadvantages of coating metals used in connector and electrical engineering, as well as current trends, are explored. Techniques for single-part electroplating, such as barrel, vibrobot, and rack plating, are presented using videos, and the possibilities of coating are illustrated with product examples. Selective plating of individual parts completes the portfolio of bulk material coating. The differences and advantages of strip plating compared to single-part plating then form the transition to strip plating. This section delves further into the specific process flow of coil plating and explains the various methods, such as immersion, brush, strip, and spot plating, using films and different selective tools. Additionally, the process-related tolerances and specifications of the various techniques are discussed, as well as the dimensional limitations of coil plating technology. Practical experience and product examples support the presentation.

In particular, the fire properties, thermal, mechanical, and electrical properties of engineering plastics are discussed, using examples, as a guide for material selection in connectors. The very different requirements arising from various markets (automotive, electrical, electronics) are taken into account. After the presentation, attendees will be able to select the material that best meets their specific requirements from the wide range of available plastic types.

As electronics become increasingly complex and interconnected, electromagnetic compatibility (EMC) management is crucial to prevent electromagnetic interference (EMI) that can degrade performance or cause malfunctions. Modern EMC measures encompass not only EMC control in high-speed circuits and power electronics but also interface optimization. Key strategies include effective filter design with transient protection, optimized grounding and contacting to minimize impedances, and consideration of the EMC behavior of interface cables. This seminar demonstrates how high-frequency interference originates and how it can be reduced at the source. Furthermore, measures along the transmission path up to the interface are presented. Here, filter circuits with inductors, capacitors, and surge-limiting components play a central role. Layout design is presented, taking into account impedance matching and signal propagation. Filter components are briefly explained, and parasitic impedances and effects that influence filter functionality are discussed. Further applications demonstrate filter topologies, grounding concepts, and the selection of suitable components. Next, grounding concepts that significantly influence EMC functionality are presented. This includes a discussion of housing shielding attenuation, connector contacting, and cable shielding attenuation, with key aspects explained. The final section describes the setup of pre-compliance measurements for interference emissions from interfaces. Early testing allows for the optimization of the EMC design of device interfaces, ensuring compliance with legal and performance requirements—a crucial factor in the development of modern electronic products.